Mercurial > ~darius > hgwebdir.cgi > stm32temp
comparison libs/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt @ 0:c59513fd84fb
Initial commit of STM32 test code.
| author | Daniel O'Connor <darius@dons.net.au> |
|---|---|
| date | Mon, 03 Oct 2011 21:19:15 +1030 |
| parents | |
| children |
comparison
equal
deleted
inserted
replaced
| -1:000000000000 | 0:c59513fd84fb |
|---|---|
| 1 /** | |
| 2 @page TIM_6Steps TIM 6 Steps example | |
| 3 | |
| 4 @verbatim | |
| 5 ******************** (C) COPYRIGHT 2011 STMicroelectronics ******************* | |
| 6 * @file TIM/6Steps/readme.txt | |
| 7 * @author MCD Application Team | |
| 8 * @version V3.5.0 | |
| 9 * @date 08-April-2011 | |
| 10 * @brief Description of the TIM 6 Steps example. | |
| 11 ****************************************************************************** | |
| 12 * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS | |
| 13 * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE | |
| 14 * TIME. AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY | |
| 15 * DIRECT, INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING | |
| 16 * FROM THE CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE | |
| 17 * CODING INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS. | |
| 18 ****************************************************************************** | |
| 19 @endverbatim | |
| 20 | |
| 21 @par Example Description | |
| 22 | |
| 23 This example shows how to configure the TIM1 peripheral to generate 6 Steps. | |
| 24 The STM32F10x TIM1 peripheral offers the possibility to program in advance the | |
| 25 configuration for the next TIM1 outputs behaviour (step) and change the configuration | |
| 26 of all the channels at the same time. This operation is possible when the COM | |
| 27 (commutation) event is used. | |
| 28 The COM event can be generated by software by setting the COM bit in the TIM1_EGR | |
| 29 register or by hardware (on TRC rising edge). | |
| 30 In this example, a software COM event is generated each 100 ms: using the SysTick | |
| 31 interrupt. | |
| 32 The TIM1 is configured in Timing Mode, each time a COM event occurs, a new TIM1 | |
| 33 configuration will be set in advance. | |
| 34 | |
| 35 The break Polarity is used at High level. | |
| 36 | |
| 37 The following Table describes the TIM1 Channels states: | |
| 38 @verbatim | |
| 39 ----------------------------------------------- | |
| 40 | Step1 | Step2 | Step3 | Step4 | Step5 | Step6 | | |
| 41 ---------------------------------------------------------- | |
| 42 |Channel1 | 1 | 0 | 0 | 0 | 0 | 1 | | |
| 43 ---------------------------------------------------------- | |
| 44 |Channel1N | 0 | 0 | 1 | 1 | 0 | 0 | | |
| 45 ---------------------------------------------------------- | |
| 46 |Channel2 | 0 | 0 | 0 | 1 | 1 | 0 | | |
| 47 ---------------------------------------------------------- | |
| 48 |Channel2N | 1 | 1 | 0 | 0 | 0 | 0 | | |
| 49 ---------------------------------------------------------- | |
| 50 |Channel3 | 0 | 1 | 1 | 0 | 0 | 0 | | |
| 51 ---------------------------------------------------------- | |
| 52 |Channel3N | 0 | 0 | 0 | 0 | 1 | 1 | | |
| 53 ---------------------------------------------------------- | |
| 54 @endverbatim | |
| 55 | |
| 56 @par Directory contents | |
| 57 | |
| 58 - TIM/6Steps/stm32f10x_conf.h Library Configuration file | |
| 59 - TIM/6Steps/stm32f10x_it.c Interrupt handlers | |
| 60 - TIM/6Steps/stm32f10x_it.h Interrupt handlers header file | |
| 61 - TIM/6Steps/main.c Main program | |
| 62 - TIM/6Steps/system_stm32f10x.c STM32F10x system source file | |
| 63 | |
| 64 @par Hardware and Software environment | |
| 65 | |
| 66 - This example runs on STM32F10x Connectivity line, High-Density, High-Density | |
| 67 Value line, Medium-Density, XL-Density, Medium-Density Value line, Low-Density | |
| 68 and Low-Density Value line Devices. | |
| 69 | |
| 70 - This example has been tested with STMicroelectronics STM32100E-EVAL (High-Density | |
| 71 Value line), STM32100B-EVAL (Medium-Density Value line), STM3210C-EVAL (Connectivity line), | |
| 72 STM3210E-EVAL (High-Density and XL-Density) and STM3210B-EVAL (Medium-Density) | |
| 73 evaluation boards and can be easily tailored to any other supported device | |
| 74 and development board. | |
| 75 | |
| 76 | |
| 77 - STM3210C-EVAL Set-up | |
| 78 - Connect the TIM1 pins(TIM1 full remapped pins) to an oscilloscope to monitor the different waveforms: | |
| 79 - TIM1_CH3 pin (PE.13) | |
| 80 - TIM1_CH1N pin (PE.08) | |
| 81 - TIM1_CH2 pin (PE.11) | |
| 82 - TIM1_CH3N pin (PE.12) | |
| 83 - TIM1_CH1 pin (PE.09) | |
| 84 - TIM1_CH2N pin (PE.10) | |
| 85 - Connect the TIM1 break pin TIM1_BKIN pin (PE.15) to the GND. To generate a | |
| 86 break event, switch this pin level from 0V to 3.3V. | |
| 87 | |
| 88 - STM3210E-EVAL, STM3210B-EVAL, STM32100B-EVAL and STM32100E-EVAL Set-up | |
| 89 - Connect the TIM1 pins to an oscilloscope to monitor the different waveforms: | |
| 90 - TIM1_CH3 pin (PA.10) | |
| 91 - TIM1_CH1N pin (PB.13) | |
| 92 - TIM1_CH2 pin (PA.09) | |
| 93 - TIM1_CH3N pin (PB.15) | |
| 94 - TIM1_CH1 pin (PA.08) | |
| 95 - TIM1_CH2N pin (PB.14) | |
| 96 - Connect the TIM1 break pin TIM1_BKIN pin (PB.12) to the GND. To generate a | |
| 97 break event, switch this pin level from 0V to 3.3V. | |
| 98 | |
| 99 | |
| 100 @par How to use it ? | |
| 101 | |
| 102 In order to make the program work, you must do the following : | |
| 103 - Copy all source files from this example folder to the template folder under | |
| 104 Project\STM32F10x_StdPeriph_Template | |
| 105 - Open your preferred toolchain | |
| 106 - Rebuild all files and load your image into target memory | |
| 107 - Run the example | |
| 108 | |
| 109 @note | |
| 110 - Low-density Value line devices are STM32F100xx microcontrollers where the | |
| 111 Flash memory density ranges between 16 and 32 Kbytes. | |
| 112 - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx | |
| 113 microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes. | |
| 114 - Medium-density Value line devices are STM32F100xx microcontrollers where | |
| 115 the Flash memory density ranges between 64 and 128 Kbytes. | |
| 116 - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx | |
| 117 microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes. | |
| 118 - High-density Value line devices are STM32F100xx microcontrollers where | |
| 119 the Flash memory density ranges between 256 and 512 Kbytes. | |
| 120 - High-density devices are STM32F101xx and STM32F103xx microcontrollers where | |
| 121 the Flash memory density ranges between 256 and 512 Kbytes. | |
| 122 - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where | |
| 123 the Flash memory density ranges between 512 and 1024 Kbytes. | |
| 124 - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers. | |
| 125 | |
| 126 * <h3><center>© COPYRIGHT 2011 STMicroelectronics</center></h3> | |
| 127 */ |